Hanking Microelectronics is developed and operated by Hanking Microelectronics (Liaoning) Co., Ltd. Established in May 2011 and located in the National New Industrialisation Demonstration Base in Shenfu New City, Liaoning Province, the company is an important operating platform for Hanking Group’s semiconductor business.
With MEMS chip design and manufacturing-process technologies at its core, the company conducts research, development and industrialisation in microelectromechanical-system chip design, manufacturing and system solutions. It has established an integrated business system encompassing research and development, production, sales and services.
The company operates an advanced eight-inch pure-play MEMS chip production line with a first-phase capacity of 10,000 wafers per month. Its process capabilities cover the principal stages of MEMS chip production, supporting product development, engineering validation and volume manufacturing.
To address a broad range of applications, the company continues to expand its portfolio of MEMS pressure and stress, acceleration, gyroscope, flow, temperature, humidity, gas and radio-frequency sensors. It can provide customers with end-to-end services extending from design and development through volume production.
Its manufacturing capabilities include thin-film deposition, metal deposition, thermal processing, wet processing, wafer bonding, etching and photolithography. Coordination across research and development, engineering, manufacturing and quality systems supports the conversion of technological achievements into stable, production-ready products.
Throughout product industrialisation, Hanking Microelectronics focuses closely on the motion, attitude and force-sensing requirements of intelligent equipment. It continues to advance inertial measurement, motion control and multi-axis force sensors and develops chips, modules and system applications in coordination, enabling core sensing capabilities to serve emerging industries including UAVs, intelligent vehicles and robotics.
HKE21105 Six-Axis Digital IMU The HKE21105 integrates a three-axis gyroscope and three-axis accelerometer in a compact package. Combining a small form factor, low power consumption and an industrial operating-temperature range, it provides angular-velocity, acceleration and attitude-sensing data for motion systems.
Designed for applications including UAV flight control, attitude stabilisation, heading control and integrated navigation, it provides essential sensing information for stable control and autonomous flight.
HKE21103M Six-Axis Digital IMU Module The HKE21103M is a compact, highly integrated six-axis inertial measurement module. Built-in compensation and multi-stage filtering algorithms enable stable data output through multiple communication interfaces, including in complex operating environments.
It can be used for vehicle dead reckoning, body-attitude monitoring, stability control and sensor fusion in intelligent driving, supplying continuous and reliable data for vehicle-motion recognition.
MEMS Multi-Axis Force Sensor The MEMS multi-axis force sensor uses an integrated structure to capture force and torque signals in multiple directions simultaneously. It combines high sensitivity and fast response with a compact form factor.
Designed for robotic-joint control, balance sensing, end effectors and force-feedback applications, it provides the sensing foundation for robot motion control, human–machine interaction and precision manipulation.
Hanking Microelectronics maintains research and development centres in Cleveland, Ohio, in the United States and Milan, Italy. These centres conduct ongoing research in MEMS process flows, structural design and packaging technologies. The company has secured more than 200 invention patents.
In 2017, the company was designated by China’s Ministry of Industry and Information Technology as a major landmark project under the Made in China 2025 initiative and was approved for inclusion in the National List of Integrated Circuit Manufacturers. It continues to strengthen its technology platform, manufacturing capabilities and market-service system, providing long-term support for the Group’s technology-sector development.